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              4寸藍寶石襯底

              2014-09-01




              藍寶石晶片



              Item


              4"

              Unit

               Dimension


              Diameter:


              100 ± 0.15

              mm


              Thickness:


              650 ± 20

              um


              Primary Flat:


              301.0

              mm

              Orientation


              Surface-cut:


              C plane : Tilt 0.2°±0.1° in M axis /

              ~


              Primary Flat:


              A plane : 0° ± 0.15°

              ~

              Flatness


              Bow:


               0 ~ (-10)

              um


              Warp:


              20

              um


              Total Thickness Variation (TTV):


              10

              um


              LTV


              2.5

              um


              Front side Roughness


              0.2

              nm


              Back side Roughness


              0.8-1.2

              um


              Cleanliness


              No particles and fingerprints

              ~


              4.Material Quality


              High-purity mono-crystal Al2O3

              ~

               

              5.Package


              Wafers are packed in cleaned wafer cassettes containing 25 wafers under clean room environment.


              ~

               

              6.Trace Ability


              Wafers shall be traceable with respect to cassette number. The wafer box should be marked with a removable label showing the date, the cassette number and the quantity.


              ~

               

              7.Laser Mark


              Front or Back side


              ~

               

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